| Supplementary figures |
| ===================== |
| |
| GPIO pads - management and user IO |
| ---------------------------------- |
| |
| .. figure:: _static/gpio_pads.svg |
| :name: gpio_pads_management_and_user_io |
| :alt: GPIO pads - management and user IO |
| :align: center |
| |
| GPIO pad structure - pads 0 (JTAG) and 1 (SDO) |
| ---------------------------------------------- |
| |
| .. figure:: _static/single_gpio_pad_structure_used_for_pad_0_and_pad_1.svg |
| :name: gpio_pad_structure_pads_0_and_1 |
| :alt: GPIO pad structure - pads 0 (JTAG) and 1 (SDO) |
| :align: center |
| |
| GPIO pad structure - all pads except 0 and 1 |
| -------------------------------------------- |
| |
| .. figure:: _static/single_gpio_pad_structure_used_all_pads_except_0_and_1.svg |
| :name: gpio_pad_structure_all_pads_except_0_and_1 |
| :alt: GPIO pad structure - all pads except 0 and 1 |
| :align: center |
| |
| Die arrangement and pads |
| ------------------------ |
| |
| .. figure:: _static/die_pads.svg |
| :name: die_arrangement_and_pads |
| :alt: Die arrangement and pads |
| :align: center |
| |
| Die voltage clamp arrangement |
| ----------------------------- |
| |
| .. figure:: _static/voltage_clamp_arrangement.svg |
| :name: voltage_clamp_arrangement |
| :alt: Voltage clamp arrangement |
| :align: center |
| |
| Die to WLCSP bond plan |
| ------------------------ |
| |
| .. figure:: _static/bond_plan.svg |
| :name: bond_plan |
| :alt: Die to WLCSP bond plan |
| :align: center |
| |
| Power domain splits |
| ------------------- |
| |
| .. figure:: _static/power_domain_splits.svg |
| :name: power_domain_splits |
| :alt: Power domain splits |
| :align: center |
| |
| PCB example route pattern |
| ------------------------- |
| |
| .. figure:: _static/pcb_example_route_pattern.svg |
| :name: pcb_example_route_pattern |
| :alt: PCB example route pattern |
| :align: center |
| |
