Added a placeholder padframe layout, and added an almost-complete
first draft of a datasheet for the chip.
diff --git a/mag/bump_bond.tcl b/mag/bump_bond.tcl
new file mode 100644
index 0000000..bb6367b
--- /dev/null
+++ b/mag/bump_bond.tcl
@@ -0,0 +1,15 @@
+namespace path {::tcl::mathop ::tcl::mathfunc}
+
+# Bump bond is a circle (approximated by a 20-sided polygon) of
+# diameter nominally 250um
+
+set rbump 125
+set coords []
+for {set i 0} {$i < 20} {incr i} {
+ set angle [* $i 18]
+ set arad [/ [* 3.1415926 $angle] 180.0]
+ lappend coords [int [* $rbump [cos $arad]]]um
+ lappend coords [int [* $rbump [sin $arad]]]um
+}
+
+eval [subst {polygon metalrdl $coords}]
