| 9.0 BOND PAD |
| ================================= |
| |
| This mask defines the opening where the bond wires connect the circuit to the lead frame. The dimensions of a |
| shrunk circuit after shrink should comply with these rules. The pad is composed of the top layer metal and pad |
| layers. Pad metal is connected to Metal1, Metal2, Metal3, Metal4, Metal5 and/or MetalTop through Via1, |
| Via2, Via3, Via4, Via5 and/or METAL_SHIELD_VIA which are located below the perimeter of the pad |
| metal. Bond pad size and pitch are limited by assembly house. |
| |
| The bond pad pitch and size should be increased whenever possible, to facilitate bonding and wafer sorting. |
| Wafer sort and assembly capabilities may impose additional constraints. It is the customer's |
| responsibility to take these additional constraints into consideration during layout. |
| |
| This mask also could be used to define the metal fuse window, if customer need metal fuse application. For the |
| metal fuse window rule, please refer chapter 11.7 in this document. |
| |
| .. toctree:: |
| :glob: |
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| drm_09_01 |
| drm_09_02 |
| drm_09_03 |
