9.0 BOND PAD
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This mask defines the opening where the bond wires connect the circuit to the lead frame. The dimensions of a
shrunk circuit after shrink should comply with these rules. The pad is composed of the top layer metal and pad
layers. Pad metal is connected to Metal1, Metal2, Metal3, Metal4, Metal5 and/or MetalTop through Via1,
Via2, Via3, Via4, Via5 and/or METAL_SHIELD_VIA which are located below the perimeter of the pad
metal. Bond pad size and pitch are limited by assembly house.

The bond pad pitch and size should be increased whenever possible, to facilitate bonding and wafer sorting.
Wafer sort and assembly capabilities may impose additional constraints. It is the customer's
responsibility to take these additional constraints into consideration during layout.

This mask also could be used to define the metal fuse window, if customer need metal fuse application. For the
metal fuse window rule, please refer chapter 11.7 in this document.

.. toctree::
    :glob:

    drm_09_01
    drm_09_02
    drm_09_03