| #Converted from s8pir-10r.itf by using itf_to_ict.pl, version 4.98 |
| # |
| process S130 { |
| background_dielectric_constant 1.0 |
| temp_reference 30 |
| } |
| # Well declarations |
| well NWELL {} |
| well PWELL {} |
| |
| # Diffusion Layers |
| diffusion P_SOURCE_DRAIN { |
| thickness 0.12 |
| resistivity 15 |
| } |
| |
| diffusion N_SOURCE_DRAIN { |
| thickness 0.12 |
| resistivity 15 |
| } |
| |
| # Conducting Layers |
| conductor ply { |
| min_spacing 0.21 |
| min_width 0.15 |
| height 0.3262 |
| thickness 0.180 |
| resistivity 48.2 |
| temp_tc1 0.0008916 |
| temp_tc2 8.443e-07 |
| gate_forming_layer true |
| wire_edge_enlargement_r { |
| wee_widths 0.15 |
| wee_spacings 0.21 |
| wee_adjustments -0.0280 |
| } |
| wire_edge_enlargement_c { |
| wee_widths 0.15 |
| wee_spacings 0.21 |
| wee_adjustments 0.0 |
| } |
| } |
| |
| conductor li { |
| min_spacing 0.17 |
| min_width 0.17 |
| height 0.9361 |
| thickness 0.100 |
| resistivity 12.8 |
| temp_tc1 0.0006045 |
| temp_tc2 -3.693e-07 |
| gate_forming_layer false |
| wire_edge_enlargement_r { |
| wee_widths 0.17 |
| wee_spacings 0.17 |
| wee_adjustments 0.0085 |
| } |
| wire_edge_enlargement_c { |
| wee_widths 0.17 |
| wee_spacings 0.17 |
| wee_adjustments 0 |
| } |
| } |
| |
| conductor m1 { |
| min_spacing 0.14 |
| min_width 0.14 |
| height 1.3761 |
| thickness 0.36 |
| resistivity 0.125 |
| temp_tc1 0.003179 |
| temp_tc2 3.094e-07 |
| gate_forming_layer false |
| wire_edge_enlargement_r { |
| wee_widths 0.14 |
| wee_spacings 0.14 |
| wee_adjustments -0.0195 |
| } |
| wire_edge_enlargement_c { |
| wee_widths 0.14 |
| wee_spacings 0.14 |
| wee_adjustments 0 |
| } |
| } |
| |
| conductor m2 { |
| min_spacing 0.14 |
| min_width 0.14 |
| height 2.0061 |
| thickness 0.360 |
| resistivity 0.125 |
| temp_tc1 0.003161 |
| temp_tc2 -7.272e-07 |
| gate_forming_layer false |
| wire_edge_enlargement_r { |
| wee_widths 0.14 |
| wee_spacings 0.14 |
| wee_adjustments -0.0195 |
| } |
| wire_edge_enlargement_c { |
| wee_widths 0.14 |
| wee_spacings 0.14 |
| wee_adjustments 0 |
| } |
| } |
| |
| conductor m3 { |
| min_spacing 0.30 |
| min_width 0.30 |
| height 2.7861 |
| thickness 0.845 |
| resistivity 0.047 |
| temp_tc1 0.003424 |
| temp_tc2 -7.739e-07 |
| gate_forming_layer false |
| wire_edge_enlargement_r { |
| wee_widths 0.30 |
| wee_spacings 0.30 |
| wee_adjustments -0.0125 |
| } |
| wire_edge_enlargement_c { |
| wee_widths 0.30 |
| wee_spacings 0.30 |
| wee_adjustments 0 |
| } |
| } |
| |
| conductor m4 { |
| min_spacing 0.30 |
| min_width 0.30 |
| height 4.0211 |
| thickness 0.845 |
| resistivity 0.047 |
| temp_tc1 0.003424 |
| temp_tc2 -7.739e-07 |
| gate_forming_layer false |
| wire_edge_enlargement_r { |
| wee_widths 0.30 |
| wee_spacings 0.30 |
| wee_adjustments -0.0125 |
| } |
| wire_edge_enlargement_c { |
| wee_widths 0.30 |
| wee_spacings 0.30 |
| wee_adjustments 0 |
| } |
| } |
| |
| conductor m5 { |
| min_spacing 1.60 |
| min_width 1.60 |
| height 5.3711 |
| thickness 1.260 |
| resistivity 0.0285 |
| temp_tc1 3.5e-3 |
| temp_tc2 -7.5e-07 |
| gate_forming_layer false |
| wire_edge_enlargement_r { |
| wee_widths 0.80 |
| wee_spacings 1.60 |
| wee_adjustments -0.0450 |
| } |
| wire_edge_enlargement_c { |
| wee_widths 0.80 |
| wee_spacings 1.60 |
| wee_adjustments 0 |
| } |
| } |
| |
| # dielectric Layers |
| dielectric FOX { |
| conformal FALSE |
| height 0.0000 |
| thickness 0.3262 |
| dielectric_constant 3.9 |
| } |
| |
| dielectric IOX { |
| conformal TRUE |
| expandedFrom ply |
| height 0.3262 |
| thickness 0.0000 |
| topThickness 0.0000 |
| sideExpand 0.0060 |
| dielectric_constant 3.9 |
| } |
| |
| dielectric SPNIT { |
| conformal TRUE |
| expandedFrom IOX |
| height 0.3262 |
| thickness 0.0000 |
| topThickness 0.1210 |
| sideExpand 0.0431 |
| dielectric_constant 7.5 |
| } |
| |
| dielectric PSG { |
| conformal FALSE |
| height 0.3262 |
| thickness 0.6099 |
| dielectric_constant 3.9 |
| } |
| |
| dielectric LINT { |
| conformal TRUE |
| expandedFrom li |
| height 0.9361 |
| thickness 0.0750 |
| topThickness 0.0750 |
| sideExpand 0.0610 |
| dielectric_constant 7.3 |
| } |
| |
| dielectric NILD2 { |
| conformal FALSE |
| height 1.0111 |
| thickness 0.3650 |
| dielectric_constant 4.05 |
| } |
| |
| dielectric NILD3_C { |
| conformal TRUE |
| expandedFrom m1 |
| height 1.3761 |
| thickness 0.0000 |
| topThickness 0.0000 |
| sideExpand 0.0300 |
| dielectric_constant 3.5 |
| } |
| |
| dielectric NILD3 { |
| conformal FALSE |
| height 1.3761 |
| thickness 0.6300 |
| dielectric_constant 4.5 |
| } |
| |
| dielectric NILD4_C { |
| conformal TRUE |
| expandedFrom m2 |
| height 2.0061 |
| thickness 0.0000 |
| topThickness 0.0000 |
| sideExpand 0.0300 |
| dielectric_constant 3.5 |
| } |
| |
| dielectric NILD4 { |
| conformal FALSE |
| height 2.0061 |
| thickness 0.7800 |
| dielectric_constant 4.2 |
| } |
| |
| dielectric NILD5 { |
| conformal FALSE |
| height 2.7861 |
| thickness 1.2350 |
| dielectric_constant 4.1 |
| } |
| |
| dielectric NILD6 { |
| conformal FALSE |
| height 4.0211 |
| thickness 1.3500 |
| dielectric_constant 4.0 |
| } |
| |
| dielectric TOPOX { |
| conformal TRUE |
| expandedFrom m5 |
| height 5.3711 |
| thickness 0.0000 |
| topThickness 0.0900 |
| sideExpand 0.0700 |
| dielectric_constant 3.9 |
| } |
| |
| dielectric TOPNIT { |
| conformal TRUE |
| expandedFrom TOPOX |
| height 5.3711 |
| thickness 0.3777 |
| topThickness 0.5400 |
| sideExpand 0.4223 |
| dielectric_constant 7.50 |
| } |
| |
| dielectric PI1 { |
| conformal FALSE |
| height 5.7488 |
| thickness 6.1346 |
| dielectric_constant 2.94 |
| } |
| |
| dielectric PI2 { |
| conformal FALSE |
| height 11.8834 |
| thickness 7.5000 |
| dielectric_constant 2.85 |
| } |
| |
| dielectric MOLD { |
| conformal FALSE |
| height 19.3834 |
| thickness 40.0000 |
| dielectric_constant 3.6 |
| } |
| |
| # Connect Layers |
| via licon1 { |
| bottom_layer P_SOURCE_DRAIN |
| top_layer li |
| contact_resistance 15 |
| } |
| |
| via licon1 { |
| bottom_layer N_SOURCE_DRAIN |
| top_layer li |
| contact_resistance 15 |
| } |
| |
| via via4 { |
| bottom_layer m4 |
| top_layer m5 |
| contact_resistance 0.38 |
| temp_tc1 0.00177 |
| temp_tc2 -1.6e-07 |
| } |
| |
| via via3 { |
| bottom_layer m3 |
| top_layer m4 |
| contact_resistance 3.41 |
| temp_tc1 0.002366 |
| temp_tc2 -1.025e-05 |
| } |
| |
| via via2 { |
| bottom_layer m2 |
| top_layer m3 |
| contact_resistance 3.41 |
| temp_tc1 0.002366 |
| temp_tc2 -1.025e-05 |
| } |
| |
| via via { |
| bottom_layer m1 |
| top_layer m2 |
| contact_resistance 4.5 |
| temp_tc1 0.001081 |
| temp_tc2 -1.903e-07 |
| } |
| |
| via mcon { |
| bottom_layer li |
| top_layer m1 |
| contact_resistance 9.3 |
| temp_tc1 0.001067 |
| temp_tc2 -5.324e-06 |
| } |
| |
| via licon1 { |
| bottom_layer ply |
| top_layer li |
| contact_resistance 152 |
| temp_tc1 0.001249 |
| temp_tc2 -6.647e-06 |
| } |
| |
