| Tim 'mithro' Ansell | 2c2b227 | 2020-06-21 16:33:08 -0700 | [diff] [blame] | 1 | Layer / Design rule,CD,,space,,Comment |
| 2 | Enclosure of fuses by polyimide,12,,,,PimFuseEnc |
| 3 | Enclosure of bondpad by polyimide (YUY-165),0.5,,,,PimPadEnc |
| 4 | "Enclosure of pad:dg by PBO inside inductor capture pad, with DECA online monitoring",4.5,,,,PBOPadEnc |
| 5 | Enclosure of pad:dg by PBO per standard DECA rules,7.5,,,,PBOPadEncDECA |
| 6 | DECA PBO drawn-to-final process bias per side,0.5,,,,PBOProcBiasPerSide |
| 7 | Polyimide CD tolerance,1,,,,PimCD_tol |
| 8 | Min Pim width over pad openings,87,,,,PimOverPad_CD |
| 9 | Polyimide slope (001-87400),,5.3,,,I_polyimide_slope |
| 10 | Enclosure of polyimide by polymer tolerance,,7.7,,,Po_po_tol |
| 11 | Min/Max enclosure of pad.dg inside M5RDL by pmm,0,,,,pmmM5RDLpadEnc |
| 12 | Min spacing of pmm to (rdl NOT (pad.dg sized by 0.5)),,,19.16,,pmmRDLspc |
| 13 | Enclosure of laser targets in the die by polyimide,30,,,,PimLaserEnc |
