| Layer / Design rule,CD,,space,,Comment | |
| Enclosure of fuses by polyimide,12,,,,PimFuseEnc | |
| Enclosure of bondpad by polyimide (YUY-165),0.5,,,,PimPadEnc | |
| "Enclosure of pad:dg by PBO inside inductor capture pad, with DECA online monitoring",4.5,,,,PBOPadEnc | |
| Enclosure of pad:dg by PBO per standard DECA rules,7.5,,,,PBOPadEncDECA | |
| DECA PBO drawn-to-final process bias per side,0.5,,,,PBOProcBiasPerSide | |
| Polyimide CD tolerance,1,,,,PimCD_tol | |
| Min Pim width over pad openings,87,,,,PimOverPad_CD | |
| Polyimide slope (001-87400),,5.3,,,I_polyimide_slope | |
| Enclosure of polyimide by polymer tolerance,,7.7,,,Po_po_tol | |
| Min/Max enclosure of pad.dg inside M5RDL by pmm,0,,,,pmmM5RDLpadEnc | |
| Min spacing of pmm to (rdl NOT (pad.dg sized by 0.5)),,,19.16,,pmmRDLspc | |
| Enclosure of laser targets in the die by polyimide,30,,,,PimLaserEnc |