| ############################################################################################################ |
| # Notes: |
| # ------ |
| # 1. This technology file was developed & tested using PVS.2010.2_13.12. |
| # |
| # RESULTS ARE NOT GUARANTEED TO OTHER VERSIONS. |
| # |
| # 2. In metal conductor connectivity checks, datatype 0 is used for polygon drawing, datatype 4 is used for |
| # metal fill, and datatype 10 is used for label polygon. The three datatypes form final metal connection. |
| # The User need to pay attention to the different datatype purpose in the connectivity in the design. |
| # |
| # 3. For PEX result accuracy, please DO NOT draw a single LVS_RF layer to cover more than one RF device. |
| # |
| # 4. LDMOS structure is under preliminary implementation in this LVS release. |
| # |
| ############################################################################################################ |
| # Revision History: |
| # ----------------- |
| # Please refer to Update History in cmos018ic.dgo.lvs.pvs. |
| # |
| ############################################################################################################ |
| |
| *.EQUIV Chartered_Model_Name=Schematic_Netlist_Model_Name |
