docs/ULL/physical_verification/design_manual/drm_09_3_1.rst

9.3.1 Solder Bump Pad design guidelines
============================================

This section contains the bumping design guidelines for flip chip applications,The following sub-sections use the terms defined in the table below.

.. csv-table:: Solder Bump Pad definitions
    :file: tables_clear/9.3_1_solder_bump_pad_definitions.csv
    :widths: 100, 700, 100
    :align: center

**Top Metal (Al)**

.. csv-table:: Top Metal (Al)
    :file: tables_clear/9.3_1_Top_Metal.csv
    :widths: 100, 700, 100
    :align: center

.. note::

    \* Use tolerance of 0.2um for DRC check.

.. image:: images/TM.png
    :width: 900
    :align: center
    :alt: TM