docs/ULL/physical_verification/design_manual/drm_09_02.rst

9.2 Bond Pad Guidelines
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 .. csv-table:: Bondpad_guidelines
    :file: tables_clear/9.2_Bondpad_guidelines.csv
    :widths: 100, 200 , 300 , 300 ,300


.. note::

    1. These are just default numbers for DRC purpose only, however, these are VARIABLE and the customer is advised to
       use the appropriate value acceptable to their assembly house.

    2. Top Metal is the last Metal of the product. Example, without metal shielding, for 4 layer metal product, Top Metal is
       Metal4. With metal shielding, for 5 layer metal + METAL_SHIELD product, Top Metal is METAL_SHIELD.

    3. Top Via means the top most via for the product. Example, without metal shielding, for 6 layer metal product, Top
       Via will be Via5, while for 4 layer metal product, Top Via will be Via3. With metal shielding, for 5 layer metal +
       METAL_SHIELD product, Top Via is METAL_SHIELD_VIA.

    4. Top Metal-1 means the one level lower than the last metal layer. Example, without metal shielding, for 6 layer metal
       product, Top Metal-1 will be Metal5, while for 4 layer metal product, Top Metal-1 will be Metal3. With metal
       shielding, for 5 layer metal + METAL_SHIELD product, Top Metal-1 is Metal5, while for 6 layer metal +
       METAL_SHIELD product, Top Metal-1 is MetalTop.

    5. Those Via under Pad opening oversize by rule PAD.4 but excluding PAD will be checked by this rule.

    6. For wedge type pad metal is checked by metal1 to Top Metal2 interact with pad enclosed by Pad opening oversize
       by rule PAD.4, for ball type wire bond (with CUP) and gold bump, pad metal checked by Top Metal2 oversize by
       rule PAD.4.

.. image:: images/PAD.png
    :width: 900
    :align: center
    :alt: PAD