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4.1 Drawn layer definition and abbreviation
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.. csv-table:: Drawn layers
:file: tables_clear/4.1_table_layerdiff.csv
:widths: 100, 200, 400, 100, 100
.. note::
1. Used in the dummy COMP, dummy poly2 & dummy metal generation algorithm (YI-141-GR003).
2. See section 11 for complete list of analog-specific layers and masks.
3. Based on the spec YI-103-SC001/YI-141-SC001.
4. Metal1_Dummy and Metal2_Dummy are dummy fills for Metal1 and Metal2. Data type is used to
differentiate between circuits and dummy Metal1 and Metal2. This separation is to facilitate
generation of dummy poly2. Dummy poly2 needs to be generated when prime die poly2 density
falls below poly2 density requirement. Circuit and metal dummy fill will be OR after dummy
poly2 is generated (where applicable).
5. Metal3_Dummy, Metal4_Dummy, Metal5_Dummy and MetalTop_Dummy are metal dummy
fills. These are separated from circuit metal by using different data type.
6. Used for all logic, analog and RF processes.
7. ESD is optional mask to provide ESD implant for MV I/Os.
8. CAP_MK is used to define the bottom plate of the MIM Capacitor for DRC purpose. It will also
be used for LVS purposes. Refer to EDA-CAD-000-GS003 (LVS Recognition and Extraction
Guideline) for more information and guidelines on LVS marking layers.
9. DRC_BJT is used for DRC purpose to avoid PL.6 and DF.3C rule.
10. V5_XTOR is used as a marking layer to define 5V MV CMOS transistor. Minimum channel
length for 5V device is 0.5um while 6V device minimum channel length is 0.6um. Whenever
transistor is enclosed by V5_Xtor layer, the minimum channel length is 0.5um.
11. MIM_L_MK marking layer is used to indicate the length of MIM capacitor. The width of
MIM_L_MK is fixed to 0.1um and its length equals to the length of the MIM capacitor in which
layer MIM_L_MK exists.
12. MOS_CAP_MK layer is used to identify the NMOS or PMOS capacitor