| RULE NO.,DESCRIPTION,LAYOUT RULE | |
| Layer,MT30 = 30K MetalTop, | |
| MTK.1,"Thick MetalTop width | |
| (For metal line width >12um, GLOBALFOUNDRIES will generate metal | |
| slot in the wide metal line.)",1.50 | |
| MTK.2a,Minimum space between thick MetalTop,1.50 | |
| MTK.2b,Minimum space between wide (length & width > 30um) MetalTop.,1.50 | |
| MTK.2c,The separation of two corners should satisfy the minimum spacing,1.50 | |
| MTK.2d,"The separation of single metal line from a any degree metal line should satisfy | |
| the minimum spacing",1.50 | |
| MTK.7,MetalTop must not be electrically floating, | |
| MTK.8,"MetalTop density within die plus grid area must be >30% Calculations should | |
| include bond pad and grid areas. (Refer to section 13.0 for Dummy Metal-fill | |
| guidelines. Customer needs to ensure enough dummy metal to satisfy metal | |
| coverage)", | |
| G.MTK.9a,"As via size compare to min thick-metal width is very small. Single top via | |
| (e.g Via3 for 4 layer metal process with 25K/20K thick top metal option, in | |
| other words via connecting to thick metal) at one location is not | |
| recommended to exit under the thick Metaltop.",DRC check | |
| G.MTK.9b,"There shall be minimum 2X2 array of vias (top vias) at one location | |
| connecting to thick top metal",DRC check |