| 9.3 Guidelines For Solder Bumping Technology | |
| ============================================ | |
| The purpose is to outline the basic wafer bumping design rules for GlobalFoundries' wafers using GlobalFoundries Turn-Key outsource wafer-bumping subcontractor. The scope is all GlobalFoundries wafers designed to be solder bumped for flip chip application. | |
| .. toctree:: | |
| :glob: | |
| drm_09_3_1 |