| 9.1 Bond Pad Rules | |
| ================================= | |
| This section covers the design rules related to wire-bond and gold bump cases and for solder bump please refer | |
| to section 9.4 | |
| .. csv-table:: pad_rules | |
| :file: tables_clear/9.1_Bond_Pad_rules.csv | |
| :widths: 100, 200 , 300,300,300 |