| 9.3.1 Solder Bump Pad design guidelines |
| ============================================ |
| |
| This section contains the bumping design guidelines for flip chip applications,The following sub-sections use the terms defined in the table below. |
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| .. csv-table:: Solder Bump Pad definitions |
| :file: tables_clear/9.3_1_solder_bump_pad_definitions.csv |
| :widths: 200, 700 |
| :align: center |
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| **Top Metal (Al)** |
| |
| .. csv-table:: Top Metal (Al) |
| :file: tables_clear/9.3_1_Top_Metal.csv |
| :widths: 100, 700, 100 |
| :align: center |
| |
| .. note:: |
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| \* Use tolerance of 0.2um for DRC check. |
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| .. image:: images/TM.png |
| :width: 900 |
| :align: center |
| :alt: TM |
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| |
