| RULE NO.,DESCRIPTION,"LAYOUT |
| GUIDELINE" |
| Layer,DMF – Dummy Metal Fill, |
| ,"Use PMNDMY mark layer to exclude dummy metal generation in |
| |
| certain critical analog/RF areas.", |
| DM.1,Min/Max Dummy metal line width/length,2.0 um |
| DM.2a*,Min Dummy metal line space (for Layout),1.2 um |
| DM.2b,Min Dummy metal line space (for DRC),0.98um |
| DM.2c,Min Dummy metal line space for thick top metal (3um Top metal),2.0um |
| DM.3,Minimum space between dummy metal and circuit Metal line,2.0um |
| DM.4,"Dummy Metal space to Subsequent Metal layer (E.g. Dummy M1 |
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| space to M2)",1um |
| DM.5,"Dummy Metal space to Previous Metal layer (E.g. Dummy M2 |
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| space to M1; Dummy M1 space to Poly2)",1um |
| DM.6,No overlap of Dummy Metal with the Subsequent Metal layers, |
| DM.7,No overlap of Dummy Metal with the Previous layers, |
| DM.8,"There should not be any dummy metal pattern fill in the following areas |
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| (i) MIM CAP area (recognized by Fuse Top) |
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| (ii) Poly fuse area (recognized by POLYFUSE) |
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| (iii) Metal fuse area (recognized by FUSEWINDOW_D) |
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| (iv) Dummy metal exclusion area (recognized by PMNDMY) |
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| (v) MTP mark area (recognized by MTPMK) |
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| (vi) OTP mark area ( recognized by OTP_MK) |
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| Space from these Structures",6um |
| DM.9*,"Do not use exact replicates of dummy metal fill patterns for |
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| consecutive metal layers to avoid dielectric and metal stress |
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| problems? E.g. the Metal4 dummy metal fill patterns should not be |
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| an exact copy of the Metal3 dummy fill pattern. (Offsets value:)",0.5um |
| DM.10*,Offset between the Dummy metal of the same layers,0.5um |
