| NO.,DESCRIPTION,LAYOUT RULE |
| TM.1,Passivation Opening (Pad mask),A |
| TM.1a,Min Passivation Opening,40 |
| TM.2*,UBM Opening,A+20 |
| TM.2a,"Min UBM Opening (defined by the layers UBMPPeri or UBMPArray |
| or UBMEPlate layers depending upon the process)",60 |
| TM.3,Bump Pad (Top metal in this case),A+32 |
| TM.3a,Min Bump Pad,72 |
| TM. 3b*,Bump Pad larger then UBM Opening,6 / per side |
| TM. 4,"Space from centre of Pad to Die Edge (Outer edge of |
| GUARD_RING_MK marking)",90 |
| TM. 5,Min allowable bump pitch,">= 70 + |
| (1.3*TM.2)" |
| TM.6,"Pad without UBM layers is not allowed except the Pad under |
| PROBE_MK marking.",Not allowed |
| TM.7,"Shape of the Pad shall be at least octagonal (or more closer to |
| circular) except the Pad under PROBE_MK marking.",DRC check |
| TM.8,Space from edge of top via to the edge of UBM opening,2 |
| TM.9,Partially overlap of top via with passivation opening is not allowed,DRC check |
| TM.10,Space from edge of top via to the edge of passivation opening,2 |
