| 9.4.4 Alignment Mark for bumping process | |
| ============================================ | |
| Following diagram shows the alignment mark to be drawn in top metal for the flip chip process. For exact location and size conformation respective assembly house shall be consulted. | |
| .. image:: images/align.png | |
| :width: 800 | |
| :align: center | |
| :alt: Alignment Mark for bumping process | |