| 9.4.3 Solder Bump Pad design guidelines | |
| ============================================ | |
| This section contains the bumping design guidelines for flip chip applications | |
| **Top Metal (Al)** | |
| .. csv-table:: Top Metal (Al) | |
| :file: tables_clear/31_Top_Metal_76.csv | |
| :widths: 100, 700, 100 | |
| :align: center | |
| .. note:: | |
| \* Use tolerance of 0.2um for DRC check. | |
| .. image:: images/bump2.png | |
| :width: 900 | |
| :align: center | |
| :alt: TM | |