| 14.6 Stress Relief Guidelines | |
| ============================= | |
| The following rules and guidelines apply to wide metal lines normally used for power supply routing. | |
| Reliability problems associated with these wide metal lines normally manifest it as dielectric film cracks and/or metal smeared as a results of stress induced due to thermal mismatch between different films in integrated circuits like metal, dielectrics & molding compounds. | |
| .. toctree:: | |
| :glob: | |
| drm_14_6_1 | |
| drm_14_6_2 | |
| drm_14_6_3 |