| 9.1 Bond Pad Rules | |
| ================== | |
| This section covers the design rules related to wire-bond and gold bump cases and for solder bump please refer to section 8.0 | |
| .. csv-table:: Bond Pad Rules | |
| :file: tables_clear/29_BondPad1_70.csv | |
| :widths: 100, 400, 150, 150, 150 | |
| :align: center | |