| GUIDELINE NO.,DESCRIPTION,"Wedge type |
| Wire bond |
| (without CUP)","Ball type |
| Wire bond |
| (with CUP)",Gold bump |
| Layer ,Pad,,, |
| PAD.1 ,Pad opening1,40,40,4 |
| PAD.2 ,Pad opening to pad opening (1),9,9,9 |
| PAD.5 ,MetalTop (2) overlap of Top_Via (3),0.5,0.5,0.5 |
| PAD.6 ,MetalTop-1 (4) overlap of Top_Via (3),0.5,0.5,0.5 |
| PAD.7 ,Metal5 overlap of Via4,0.5,0.5,-- |
| PAD.8 ,Metal4 overlap of Via4,0.5,0.5,-- |
| PAD.9 ,Metal4 overlap of Via3,0.5,0.5,-- |
| PAD.10 ,Metal3 overlap of Via3,0.5,0.5,-- |
| PAD.11 ,Metal3 overlap of Via2,0.5,0.5,-- |
| PAD.12 ,Metal2 overlap of Via2,0.5,0.5,-- |
| PAD.13 ,Metal2 overlap of Via1,0.5,0.5,-- |
| PAD.14 ,Metal1 overlap of Via1,0.5,0.5,-- |
| PAD.15,"Min pad opening space to nearest S/L guard ring |
| |
| (Inner edge of GUARD_RING_MK marking)",30,30,30 |
| PAD.16 ,"Max pad opening space to nearest S/L guard ring |
| |
| (Inner edge of GUARD_RING_MK marking)",200,200,NA |
| PAD.17 , Pad opening space to active circuit COMP,15, NA,NA |
| PAD.18 , Pad opening space to active circuit Poly2,15, NA,NA |
| PAD.19a,"Pad opening to non-pad circuit Metal1, 2, 3, 4,5 |
| |
| Up to MetalTop-1",6,NA,NA |
| PAD.19b ,Pad opening to non-pad circuit MetalTop,6,6,6 |
| PAD.20 ,Pad metal to pad metal space,5,5,5 |
| PAD.21,"FOR other rules specific to CUP (circuit under pad |
| |
| Case) refer to section 9.3",,, |
