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9.4.3 Solder Bump Pad design guidelines
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This section contains the bumping design guidelines for flip chip applications
**Top Metal (Al)**
.. csv-table:: Top Metal (Al)
:file: tables_clear/31_Top_Metal_76.csv
:widths: 100, 700, 100
:align: center
.. note::
\* Use tolerance of 0.2um for DRC check.
.. image:: images/bump2.png
:width: 900
:align: center
:alt: TM