| NO.,DESCRIPTION,LAYOUT RULE | |
| PM.1,Min PROBE_MK overlap of probe pad passivation opening,0 | |
| PM.2,Min probe pad passivation opening1,50 | |
| PM.3,Min probe pad pitch1,80 | |
| PM.4,Min Probe pad top layer metal overlap of pad opening,2 | |
| PM.5,Min Probe pad passivation opening to solder bump UBM opening,13 |