| RULE NO.,DESCRIPTION,LAYOUT RULE |
| Layer,MT30 = 3um Metal Top, |
| MT30.1,"(a) Min. thick MetalTop width |
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| (b) Min width for >1000um long metal line (based on metal edge)","1.8 |
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| 2.2" |
| MT30.2,Min. thick MetalTop space,1.8 |
| MT30.3,The separation of two corners should satisfy the minimum spacing,1.8 |
| MT30.4,The separation of single metal line from a any degree metal line should satisfy the minimum spacing,1.8 |
| MT30.5,Minimum thick MetalTop enclose underlying via (for example: via5 for 6LM case) [Outside Not Allowed],0.12 |
| MT30.6,Thick MetalTop end-of-line (width <2.5um) enclose underlying via (for example: via5 for 6LM case) [Outside Not Allowed],0.25 |
| MT30.7,"Thick MetalTop coverage over the entire die shall be >30% |
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| (Refer to section 13.0 for Dummy Metal-fill guidelines. Customer needs to |
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| Ensure enough dummy metal to satisfy Metaln coverage)", |
| MT30.8a,"As via size compare to min thick-metal width is very small. Single top via |
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| (e.g Via3 for 4 layer metal process with 3.0um thick top metal option. |
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| in other words via connecting to thick metal) At one location cannot exit under the thick (3um thick) metal.", DRC check |
| MT30.8b,"There shall be minimum 2X2 array of vias (top vias) at one location connecting to 3um thick top metal. |
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| Note: This rule will not checked for seal ring area (identified by GUARD_RING_MK |
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| As the via rules in this area are separately covered under seal ring section)", DRC check |