)]}'
{
  "commit": "6a0750aa6c902a28bf4e05e17c5a0777aed19ba5",
  "tree": "98453ab9f7037cd684cdf28d4a1d72c69dddf10b",
  "parents": [
    "6d9739daf9049ade53d95f23fe209ac73a31dab7"
  ],
  "author": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Mon Oct 19 14:02:05 2020 -0400"
  },
  "committer": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Mon Oct 19 14:02:05 2020 -0400"
  },
  "message": "Updated the datasheet corresponding to a modified padframe and bump\nbond plan, with (1) four bump bonds added in the center to connect\nto the common management area ground; (2) power supply pins for the\nuser area moved up into the user area for routability, and (3) pads\naligned to the 0.5mm bump pitch for better redistribution layer\nrouting.\n",
  "tree_diff": [
    {
      "type": "modify",
      "old_id": "be30ab250de62257a8e559340effc3e5a2c96d36",
      "old_mode": 33188,
      "old_path": "doc/caravel_datasheet.ps",
      "new_id": "c2b0b1f9a0fd35bcdcd36e235a1e90317fa5c97e",
      "new_mode": 33188,
      "new_path": "doc/caravel_datasheet.ps"
    }
  ]
}