tree 98453ab9f7037cd684cdf28d4a1d72c69dddf10b
parent 6d9739daf9049ade53d95f23fe209ac73a31dab7
author Tim Edwards <tim@opencircuitdesign.com> 1603130525 -0400
committer Tim Edwards <tim@opencircuitdesign.com> 1603130525 -0400

Updated the datasheet corresponding to a modified padframe and bump
bond plan, with (1) four bump bonds added in the center to connect
to the common management area ground; (2) power supply pins for the
user area moved up into the user area for routability, and (3) pads
aligned to the 0.5mm bump pitch for better redistribution layer
routing.