tree b8c969c3f425e98aa7f7c186a08d2cf8d75988f4
parent 12df12e2e74145e31c5a13de02f9a1e176b56e67
author Tim Edwards <tim@opencircuitdesign.com> 1680279183 -0400
committer Tim Edwards <tim@opencircuitdesign.com> 1680279183 -0400

Added custom LEF view of sky130_fd_io__top_gpiov2 because the existing
version in the PDK places ports for the "noesd" pin connection over
areas that are inside the pad and cause the netlist to short the "noesd"
pin to the pad.  Also:  Made modifications to the Micross bump bond tech
file, as the existing one was causing artifacts to appear on some layers.
Avoided this by separating all bump bond layers onto separate planes.