)]}'
{
  "commit": "fa35ae203e670aac5c274902ff55f57d08f64b5b",
  "tree": "4c9d266c8356655e99fae6af34819ce343eb5aab",
  "parents": [
    "320242b352f150be444eec62e5026e39a1d5409e"
  ],
  "author": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Wed Oct 21 10:59:05 2020 -0400"
  },
  "committer": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Wed Oct 21 10:59:05 2020 -0400"
  },
  "message": "Provisional additions of under-bump material and redistribution\nlayer vias (testing whether these layers can be derived or need\nto be explicitly drawn).\n",
  "tree_diff": [
    {
      "type": "modify",
      "old_id": "7d87b56a96e0129b615c8126c0a62232232de5be",
      "old_mode": 33188,
      "old_path": "sky130/magic/sky130.tech",
      "new_id": "e003d7b30e7bd8604b7b75dce02940013159c290",
      "new_mode": 33188,
      "new_path": "sky130/magic/sky130.tech"
    }
  ]
}