)]}'
{
  "commit": "d8c159536699c9b4a08b650bddf791a9d48152f9",
  "tree": "93a8b16bc1ca7124831fb67e5ecb9b17d07884cf",
  "parents": [
    "f63ee05837dcede8ece009f2ebbe5be2ffb14e20"
  ],
  "author": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Thu Apr 29 15:52:27 2021 -0400"
  },
  "committer": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Thu Apr 29 15:52:27 2021 -0400"
  },
  "message": "Corrected the height/thickness stackup in the extraction section of\nthe magic techfile to reflect the fact that there is no polyimide\nlayer on top of the whole chip, leading to a lower position of the\nRDL layer.\n",
  "tree_diff": [
    {
      "type": "modify",
      "old_id": "9acc828acb05869708c47162903582388595fb57",
      "old_mode": 33188,
      "old_path": "sky130/magic/sky130.tech",
      "new_id": "9e288ad771fcd6baa1ec9267b358472c4ed0e8ed",
      "new_mode": 33188,
      "new_path": "sky130/magic/sky130.tech"
    }
  ]
}