)]}'
{
  "commit": "b209d1e02a8700178ed9ec5728ea061f4d803d74",
  "tree": "df5f949461e155864067267157732f6e863b2206",
  "parents": [
    "6aa8c144801934f4caac26886b58e0bfdccc2282"
  ],
  "author": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Tue Feb 16 13:09:01 2021 -0500"
  },
  "committer": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Tue Feb 16 13:09:01 2021 -0500"
  },
  "message": "Adjusted fill for m1 to m4 from 0.6um spacing to 0.8um spacing for\nthe coarse fill patterns;  maximum density reduced from 59% to 51%\nwhich should prevent failing full chip density.\n",
  "tree_diff": [
    {
      "type": "modify",
      "old_id": "f0683f43555bfb2f7f65c0086512e7a937dedd0d",
      "old_mode": 33188,
      "old_path": "sky130/magic/sky130.tech",
      "new_id": "e9ee04d67a3427d8171f62ae9c30f0e342410952",
      "new_mode": 33188,
      "new_path": "sky130/magic/sky130.tech"
    }
  ]
}
