)]}'
{
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  "tree": "7a2a74d99aabcc7d57e8991eaefbd8dcc09336fc",
  "parents": [
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  ],
  "author": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Thu Jan 28 09:46:54 2021 -0500"
  },
  "committer": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Thu Jan 28 09:46:54 2021 -0500"
  },
  "message": "Corrections and updates to the bump-bond technology file and accompanying\nscript procedures.\n",
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}