tree 510fbb6961906734dd2d246823df2d173a6d53ff
parent c12bcdcd0a08470cd6351923ccb8f95d426f8d4f
author Tim Edwards <tim@opencircuitdesign.com> 1613499137 -0500
committer Tim Edwards <tim@opencircuitdesign.com> 1613499137 -0500

Updated metal1 to metal4 fill to increase pattern spacing for
coarse patterning from 0.6um to 0.8um to reduce the maximum pattern
density from 59% to about 51%, especially as being so close to the
limit was pushing metal4 full-chip density over the limit due to
the wide m4 buses on the I/O cells.