Updated metal1 to metal4 fill to increase pattern spacing for
coarse patterning from 0.6um to 0.8um to reduce the maximum pattern
density from 59% to about 51%, especially as being so close to the
limit was pushing metal4 full-chip density over the limit due to
the wide m4 buses on the I/O cells.
diff --git a/sky130/magic/sky130.tech b/sky130/magic/sky130.tech
index d2cfbea..d25895f 100644
--- a/sky130/magic/sky130.tech
+++ b/sky130/magic/sky130.tech
@@ -1977,7 +1977,7 @@
grow 3000
templayer met1fill_coarse topbox
# slots 0 2000 200 0 2000 200 700 0
- slots 0 2000 600 0 2000 600 700 350
+ slots 0 2000 800 0 2000 800 700 350
and-not obstruct_m1_coarse
and topbox
shrink 995
@@ -2029,7 +2029,7 @@
grow 3000
templayer met2fill_coarse topbox
# slots 0 2000 200 0 2000 200 700 350
- slots 0 2000 600 0 2000 600 700 350
+ slots 0 2000 800 0 2000 800 700 350
and-not obstruct_m2
and topbox
shrink 995
@@ -2081,7 +2081,7 @@
grow 3000
templayer met3fill_coarse topbox
# slots 0 2000 300 0 2000 300 700 700
- slots 0 2000 600 0 2000 600 700 350
+ slots 0 2000 800 0 2000 800 700 350
and-not obstruct_m3
and topbox
shrink 995
@@ -2135,7 +2135,7 @@
grow 3000
templayer met4fill_coarse topbox
# slots 0 2000 300 0 2000 300 700 1050
- slots 0 2000 600 0 2000 600 700 350
+ slots 0 2000 800 0 2000 800 700 350
and-not obstruct_m4
and topbox
shrink 995
