Updated metal1 to metal4 fill to increase pattern spacing for coarse patterning from 0.6um to 0.8um to reduce the maximum pattern density from 59% to about 51%, especially as being so close to the limit was pushing metal4 full-chip density over the limit due to the wide m4 buses on the I/O cells.
diff --git a/sky130/magic/sky130.tech b/sky130/magic/sky130.tech index d2cfbea..d25895f 100644 --- a/sky130/magic/sky130.tech +++ b/sky130/magic/sky130.tech
@@ -1977,7 +1977,7 @@ grow 3000 templayer met1fill_coarse topbox # slots 0 2000 200 0 2000 200 700 0 - slots 0 2000 600 0 2000 600 700 350 + slots 0 2000 800 0 2000 800 700 350 and-not obstruct_m1_coarse and topbox shrink 995 @@ -2029,7 +2029,7 @@ grow 3000 templayer met2fill_coarse topbox # slots 0 2000 200 0 2000 200 700 350 - slots 0 2000 600 0 2000 600 700 350 + slots 0 2000 800 0 2000 800 700 350 and-not obstruct_m2 and topbox shrink 995 @@ -2081,7 +2081,7 @@ grow 3000 templayer met3fill_coarse topbox # slots 0 2000 300 0 2000 300 700 700 - slots 0 2000 600 0 2000 600 700 350 + slots 0 2000 800 0 2000 800 700 350 and-not obstruct_m3 and topbox shrink 995 @@ -2135,7 +2135,7 @@ grow 3000 templayer met4fill_coarse topbox # slots 0 2000 300 0 2000 300 700 1050 - slots 0 2000 600 0 2000 600 700 350 + slots 0 2000 800 0 2000 800 700 350 and-not obstruct_m4 and topbox shrink 995