Added a set of Tcl routines for generating bump bonds for the Micross
post-processing.
diff --git a/sky130/Makefile.in b/sky130/Makefile.in
index e86e1e9..c8fed53 100644
--- a/sky130/Makefile.in
+++ b/sky130/Makefile.in
@@ -328,6 +328,7 @@
rm -f ${MAGIC_STAGING_A}/magicrc
(cd ${MAGICTOP_STAGING_A} ; ln -s ${REV_DIR} current)
cp -rp custom/scripts/seal_ring_generator ${MAGIC_STAGING_A}/.
+ cp -rp custom/scripts/bump_bond_generator ${MAGIC_STAGING_A}/.
cp custom/scripts/generate_fill.py ${MAGIC_STAGING_A}/.
cp custom/scripts/check_density.py ${MAGIC_STAGING_A}/.
${CPP} ${SKY130A_DEFS} magic/${TECH}.tech > ${MAGIC_STAGING_A}/${SKY130A}.tech
