)]}'
{
  "commit": "46dc5fed4d83c3681ea7f00dfdd7a550b42359af",
  "tree": "cfdf8af47667f491f90e78af28c352a855b4059e",
  "parents": [
    "956e30225ce9d91b9768c0bc064881ef3dd59876"
  ],
  "author": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Fri May 28 11:46:33 2021 -0400"
  },
  "committer": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Fri May 28 11:46:33 2021 -0400"
  },
  "message": "Added a new pad sky130_ef_io__top_power_hvc for the \"caravan\" chip which\ninstantiates the sky130_fd_io__top_power_hvc_wpadv2 but with approximately\nthree times the width on the metal3 connection between pad and core, for high\ncurrent supply applications.\n",
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