)]}'
{
  "commit": "033bf32b5521527ff9a088df077cfcf08ea8fe1e",
  "tree": "3dd41ec0a9ad41b279dc823530298dfd09b0c46b",
  "parents": [
    "ffb8b6116e801f1eef6c15121bab2aabab56540f"
  ],
  "author": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Thu Dec 08 12:56:57 2022 -0500"
  },
  "committer": {
    "name": "Tim Edwards",
    "email": "tim@opencircuitdesign.com",
    "time": "Thu Dec 08 12:56:57 2022 -0500"
  },
  "message": "Modified the fillblock layer in the magic tech file to prevent it\nfrom generating layer 111 (COMP (diffusion) fill block).  The layer\nis not intended to block diffusion fill (which is usually\ndisallowed by foundries, although not for GF180MCU).\n",
  "tree_diff": [
    {
      "type": "modify",
      "old_id": "4e118ec82c93567c4592b056fd172061fa6eb9cc",
      "old_mode": 33188,
      "old_path": "VERSION",
      "new_id": "aae54125935eef27e7ebc3ce6017c86bfad9bcc1",
      "new_mode": 33188,
      "new_path": "VERSION"
    },
    {
      "type": "modify",
      "old_id": "838e34546c0675d287564cf783320e4c2bee77d4",
      "old_mode": 33188,
      "old_path": "gf180mcu/magic/gf180mcu.tech",
      "new_id": "c08edc7b3e20d620fc04da5941c88cf6e89ff962",
      "new_mode": 33188,
      "new_path": "gf180mcu/magic/gf180mcu.tech"
    }
  ]
}