# SKY90FD Technology LEF

VERSION 5.7 ;
BUSBITCHARS "[]" ;
DIVIDERCHAR "/" ;

PROPERTYDEFINITIONS
  LAYER LEF58_TYPE STRING ;
END PROPERTYDEFINITIONS

UNITS
  DATABASE MICRONS 1000 ;
  TIME NANOSECONDS 1 ;
  VOLTAGE VOLTS 1 ;
  CURRENT MILLIAMPS 1 ;
  POWER MILLIWATTS 1 ;
END UNITS

MANUFACTURINGGRID 0.005 ;
LAYER OVERLAP
  TYPE OVERLAP ;
END OVERLAP

# Layers up to bottom of metal

LAYER CAPP
  TYPE IMPLANT ;
  WIDTH 0.32 ;
END CAPP

LAYER VTN1
  TYPE IMPLANT ;
END VTN1

LAYER VTP1
  TYPE IMPLANT ;
END VTP1

LAYER VTN2
  TYPE IMPLANT ;
END VTN2

LAYER VTP2
  TYPE IMPLANT ;
END VTP2

LAYER POLY
  TYPE MASTERSLICE ;
END POLY

LAYER NSD
  TYPE IMPLANT ;
  WIDTH 0.2 ;
END NSD

LAYER PSD
  TYPE IMPLANT ;
  WIDTH 0.2 ;
END PSD

LAYER CON
  TYPE CUT ;
  SPACING 0.13 ;
  WIDTH 0.13 ;
  ENCLOSURE ABOVE 0.015 0.035 ;
END CON


LAYER M1Cu
    TYPE ROUTING ;
    WIDTH 0.1600 ;
    AREA 0.0832 ;
    SPACING 0.1600 ;
    SPACING 0.1600 SAMENET ;
    PITCH 0.3200 ;
    DIRECTION HORIZONTAL ;
    RESISTANCE RPERSQ 0.09000000 ;
    THICKNESS 0.24000000 ;
END M1Cu

LAYER V12Cu 
    TYPE CUT ;
    RESISTANCE 5.0 ;
    SPACING 0.170 ;
    SPACING 0.00 SAMENET LAYER CON STACK ;
    ENCLOSURE BELOW 0.005 0.035 ; 
    ENCLOSURE ABOVE 0.005 0.035 ;
END V12Cu

LAYER M2Cu
    TYPE ROUTING ;
    WIDTH 0.1600 ;
    AREA 0.0952 ;
    SPACING 0.1600 ;
    SPACING 0.1600 SAMENET ;
    PITCH 0.320 ;  
    DIRECTION VERTICAL ;
    RESISTANCE RPERSQ 0.09000000 ;
    THICKNESS 0.24000000 ;
END M2Cu

LAYER V23Cu 
    TYPE CUT ;
    RESISTANCE 5.0 ;
    SPACING 0.170 ;
    SPACING 0.00 SAMENET LAYER V12Cu STACK ;
    SPACING 0.00 SAMENET LAYER CON STACK ;
    ENCLOSURE BELOW 0.005 0.035 ;
    ENCLOSURE ABOVE 0.005 0.035 ;
END V23Cu

 
LAYER M3Cu
    TYPE ROUTING ;
    WIDTH 0.1600 ;
    AREA 0.0832 ;
    SPACING 0.1600 ;
    SPACING 0.1600 SAMENET ;
    PITCH 0.3200 ;
    DIRECTION HORIZONTAL ;
    RESISTANCE RPERSQ 0.09000000 ;
    THICKNESS 0.24000000 ;
END M3Cu

LAYER V34Cu  
    TYPE CUT ;
    RESISTANCE 5.0 ;
    SPACING 0.170 ;
    SPACING 0.00 SAMENET LAYER V23Cu STACK ;
    SPACING 0.00 SAMENET LAYER V12Cu STACK ;
    SPACING 0.00 SAMENET LAYER CON STACK ;
    ENCLOSURE BELOW 0.005 0.035 ; 
    ENCLOSURE ABOVE 0.005 0.035 ;
END V34Cu

LAYER M4Cu
    TYPE ROUTING ;
    WIDTH 0.1600 ;
    AREA 0.0952 ;
    SPACING 0.1600 ;
    SPACING 0.1600 SAMENET ;
     PITCH 0.3200 ;
    DIRECTION VERTICAL ;
    RESISTANCE RPERSQ 0.09000000 ;
    THICKNESS 0.24000000 ;
END M4Cu

LAYER V45Cu 
    TYPE CUT ;
    RESISTANCE 5.0 ;
    SPACING 0.170 ;
    SPACING 0.00 SAMENET LAYER V34Cu STACK ;
    SPACING 0.00 SAMENET LAYER V23Cu STACK ;
    SPACING 0.00 SAMENET LAYER V12Cu STACK ;
    SPACING 0.00 SAMENET LAYER CON STACK ;
    ENCLOSURE BELOW 0.005 0.035 ;
    ENCLOSURE ABOVE 0.005 0.035 ;
END V45Cu

LAYER M5Cu
    TYPE ROUTING ;
    WIDTH 0.1600 ;
    AREA 0.0832 ;
    SPACING 0.1600 ;
    SPACING 0.1600 SAMENET ;
    PITCH 0.3200 ;
    DIRECTION HORIZONTAL ;
    RESISTANCE RPERSQ 0.09000000 ;
    THICKNESS 0.24000000 ;
END M5Cu


LAYER VK01
    TYPE CUT ;
    RESISTANCE 8.0 ;
    SPACING 0.170 ;
    ENCLOSURE BELOW 0.005 0.035 ; 
    ENCLOSURE ABOVE 0.035 0.035 ;
END VK01

LAYER MTK1
  TYPE ROUTING ;
  DIRECTION VERTICAL ;
  PITCH 0.48 ;
  WIDTH 0.24 ;
  AREA 0.28 ;
  SPACING 0.24 ;
  SPACING 0.48 RANGE 3 10000 ;
  THICKNESS 0.46800000 ;
  RESISTANCE RPERSQ 0.10 ;
END MTK1

LAYER VR01
  TYPE CUT ;
  RESISTANCE 7.0 ;
  WIDTH 0.17 ;
  SPACING 0.25 ;
  ENCLOSURE BELOW 0.035 0.035 ;
  ENCLOSURE ABOVE 0.095 0.095 ;
END VR01

LAYER MRF1
  TYPE ROUTING ;
  DIRECTION HORIZONTAL ;
   PITCH 0.72 ; 
  WIDTH 0.36 ;
  AREA 0.28 ;
  SPACING 0.36 ;
  SPACING 0.72 RANGE 3 10000 ;
  RESISTANCE RPERSQ 0.048 ;
  THICKNESS 0.84500000 ;
END MRF1

LAYER OGC
  TYPE CUT ;
  PROPERTY LEF58_TYPE "TYPE PASSIVATION ;" ;
  SPACING 5 ;
  WIDTH 5 ;
END OGC
 
VIARULE M1Cu_M2Cu GENERATE DEFAULT
  LAYER M1Cu ;
    ENCLOSURE 0.005 0.035 ;
  LAYER M2Cu ;
    ENCLOSURE 0.035 0.005 ;
  LAYER V12Cu ;
    RECT -0.075 -0.075 0.075 0.075 ;
    SPACING 0.32 BY 0.32 ;
END M1Cu_M2Cu

VIARULE M2Cu_M3Cu GENERATE DEFAULT
  LAYER M2Cu ;
    ENCLOSURE 0.035 0.005 ;
  LAYER M3Cu ;
    ENCLOSURE 0.005 0.035 ;
  LAYER V23Cu ;
    RECT -0.075 -0.075 0.075 0.075 ;
    SPACING 0.32 BY 0.32 ;
END M2Cu_M3Cu

VIARULE M3Cu_M4Cu GENERATE DEFAULT
  LAYER M3Cu ;
    ENCLOSURE 0.005 0.035 ;
  LAYER M4Cu ;
    ENCLOSURE 0.035 0.005 ;
  LAYER V34Cu ;
    RECT -0.075 -0.075 0.075 0.075 ;
    SPACING 0.32 BY 0.32 ;
END M3Cu_M4Cu

VIARULE M4Cu_M5Cu GENERATE DEFAULT
  LAYER M4Cu ;
    ENCLOSURE 0.035 0.005 ;
  LAYER M5Cu ;
    ENCLOSURE 0.005 0.035 ;
  LAYER V45Cu ;
    RECT -0.075 -0.075 0.075 0.075 ;
    SPACING 0.32 BY 0.32 ;
END M4Cu_M5Cu

VIARULE M5Cu_MTK1 GENERATE DEFAULT
  LAYER M5Cu ;
    ENCLOSURE 0.005 0.035 ;
  LAYER MTK1 ;
    ENCLOSURE 0.035 0.035 ;
  LAYER VK01 ;
    RECT -0.075 -0.075 0.075 0.075 ;
    SPACING 0.32 BY 0.32 ;
END M5Cu_MTK1


VIARULE MTK1_MRF1 GENERATE DEFAULT
  LAYER MTK1 ;
    ENCLOSURE 0.035 0.035 ;
  LAYER MRF1 ;
    ENCLOSURE 0.095 0.095 ;
  LAYER VR01 ;
    RECT -0.085 -0.085 0.085 0.085 ;
    SPACING 0.42 BY 0.42 ;
END MTK1_MRF1

VIA M1CuM2Cu_C DEFAULT
    LAYER M2Cu ;
        RECT -0.1100 -0.0800 0.1100 0.0800 ;
    LAYER V12Cu ;
        RECT -0.0750 -0.0750 0.0750 0.0750 ;
    LAYER M1Cu ;
        RECT -0.0800 -0.1100 0.0800 0.1100 ;
END M1CuM2Cu_C


VIA M1CuM2Cu_EW
    LAYER M2Cu ;
        RECT -0.1100 -0.0800 0.1100 0.0800 ;
    LAYER V12Cu ;
        RECT -0.0750 -0.0750 0.0750 0.0750 ;
    LAYER M1Cu ;
        RECT -0.1100 -0.0800 0.1100 0.0800 ;
END M1CuM2Cu_EW


VIA M1CuM2Cu_NS
    LAYER M2Cu ;
        RECT -0.0800 -0.1100 0.0800 0.1100 ;
    LAYER V12Cu ;
        RECT -0.0750 -0.0750 0.0750 0.0750 ;
    LAYER M1Cu ;
        RECT -0.0800 -0.1100 0.0800 0.1100 ;
END M1CuM2Cu_NS


VIA M2CuM3Cu_C
    LAYER M3Cu ;
        RECT -0.0800 -0.1100 0.0800 0.1100 ;
    LAYER V23Cu ;
        RECT -0.0750 -0.0750 0.0750 0.0750 ;
    LAYER M2Cu ;
        RECT -0.1100 -0.0800 0.1100 0.0800 ;
END M2CuM3Cu_C

VIA M3CuM4Cu_C
    LAYER M4Cu ;
        RECT -0.1100 -0.0800 0.1100 0.0800 ;
    LAYER V34Cu ;
        RECT -0.0750 -0.0750 0.0750 0.0750 ;
    LAYER M3Cu ;
        RECT -0.0800 -0.1100 0.0800 0.1100 ;
END M3CuM4Cu_C

VIA M4CuM5Cu_C
    LAYER M5Cu ;
        RECT -0.0800 -0.1100 0.0800 0.1100 ;
    LAYER V45Cu ;
        RECT -0.0750 -0.0750 0.0750 0.0750 ;
    LAYER M4Cu ;
        RECT -0.1100 -0.0800 0.1100 0.0800 ;
END M4CuM5Cu_C


VIA M5Cu_MTK1
  LAYER M5Cu ;
    RECT -0.080 -0.110 0.080 0.110 ;
  LAYER VK01 ;
    RECT -0.075 -0.075 0.075 0.075 ;
  LAYER MTK1 ;
    RECT -0.110 -0.110 0.110 0.110 ;
END M5Cu_MTK1

VIA MTK1_MRF1 
  LAYER MTK1 ;
    RECT -0.120 -0.120 0.120 0.120 ;
  LAYER VR01 ;
    RECT -0.085 -0.085 0.085 0.085 ;
  LAYER MRF1 ;
    RECT -0.180 -0.180 0.180 0.180 ;
END MTK1_MRF1


SITE core12t
  SYMMETRY Y ;
  CLASS core ;
  SIZE 0.32 BY 3.84 ;
END core12t

SITE core12tDH
  SYMMETRY Y ;
  CLASS core ;
  SIZE 0.32 BY 7.68 ;
END core12tDH

END LIBRARY