GUIDELINE NO.,DESCRIPTION,"Wedge type
Wire bond
(without CUP)","Ball type
Wire bond
(with CUP)",Gold bump
Layer ,Pad,,,
PAD.1 ,Pad opening1,40,40,4
PAD.2 ,Pad opening to pad opening (1),9,9,9
PAD.5 ,MetalTop (2) overlap of Top_Via (3),0.5,0.5,0.5
PAD.6 ,MetalTop-1 (4) overlap of Top_Via (3),0.5,0.5,0.5
PAD.7 ,Metal5 overlap of Via4,0.5,0.5,--
PAD.8 ,Metal4 overlap of Via4,0.5,0.5,--
PAD.9 ,Metal4 overlap of Via3,0.5,0.5,--
PAD.10 ,Metal3 overlap of Via3,0.5,0.5,--
PAD.11 ,Metal3 overlap of Via2,0.5,0.5,--
PAD.12 ,Metal2 overlap of Via2,0.5,0.5,--
PAD.13 ,Metal2 overlap of Via1,0.5,0.5,--
PAD.14 ,Metal1 overlap of Via1,0.5,0.5,--
PAD.15,"Min pad opening space to nearest S/L guard ring

(Inner edge of GUARD_RING_MK marking)",30,30,30
PAD.16 ,"Max pad opening space to nearest S/L guard ring

(Inner edge of GUARD_RING_MK marking)",200,200,NA
PAD.17 , Pad opening space to active circuit COMP,15, NA,NA
PAD.18 , Pad opening space to active circuit Poly2,15, NA,NA
PAD.19a,"Pad opening to non-pad circuit Metal1, 2, 3, 4,5

Up to MetalTop-1",6,NA,NA
PAD.19b ,Pad opening to non-pad circuit MetalTop,6,6,6
PAD.20 ,Pad metal to pad metal space,5,5,5
PAD.21,"FOR other rules specific to CUP (circuit under pad

Case) refer to section 9.3",,,