9.4 Guidelines For Solder Bumping Technology
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The purpose is to outline the basic wafer bumping design rules for GlobalFoundries' wafers using GlobalFoundries Turn-Key outsource wafer-bumping subcontractor. The scope is all GlobalFoundries wafers designed to be solder bumped for flip chip application.

.. toctree::
    :glob:

    drm_09_4_1
    drm_09_4_2
    drm_09_4_3
    drm_09_4_4
    drm_09_4_5